Informations liées à la commande
1.5V
| No. d'article |
RAM |
Type de module |
Vitesse |
Appareil |
Description |
| TS16GJMA524H |
DDR3 |
Unbuffered SO-DIMM |
1600 |
Mac® |
4GB x4
1.5V
512Mx8
|
| TS32GJMA524H |
DDR3 |
Unbuffered SO-DIMM |
1600 |
Mac® |
8GB x4
1.5V
512Mx8
|
| TS8GJMA424H |
DDR3 |
Unbuffered SO-DIMM |
1600 |
Mac® |
4GB x2
1.5V
512Mx8
|
| TS16GJMA424H |
DDR3 |
Unbuffered SO-DIMM |
1600 |
Mac® |
8GB x2
1.5V
512Mx8
|
| TS4GJMA324H |
DDR3 |
Unbuffered SO-DIMM |
1600 |
Mac® |
4GB
1.5V
512Mx8
|
| TS8GJMA324H |
DDR3 |
Unbuffered SO-DIMM |
1600 |
Mac® |
8GB
1.5V
512Mx8
|
Spécifications
Module DRAM
|
| Type RAM |
|
| Type DIMM |
|
| Vitesse |
|
| Latence CAS |
|
| Capacité |
|
| Rang |
|
| DRAM |
|
| Tension |
1.5V |
| Broche |
0 pin |
| Hauteur PCB |
0 pouces |
Environnement d'exploitation
|
| Température de fonctionnement |
0°C (32°F) ~ 85°C (185°F) |
Garantie
|
| Garantie |
|
| Politique de garantie |
- Veuillez cliquer sur ici pour plus d'informations sur la Politique de garantie Transcend.
|
Customization
Underfill
Underfill provides a strong mechanical bond between key components and the underlying printed circuit board (PCB). By spreading stresses throughout the chip and PCB interface with a mechanical bond, less stress is concentrated on the solder joints, increasing device reliability.
Conformal Coating
Conformal coatings can be applied via a range of methods including manual brushing, manual spraying, dipping, or by automated spraying machines.
Wide Temperature
To ensure that all of its devices can be operated under even the harshest conditions, Transcend utilizes wide temperature technology, allowing our flash and DRAM modules to operate and perform reliably in extreme temperatures.